You will be responsible for computing architecture design for future wireless products. You will define requirement, evaluate design alternatives, drive technical studies, specify functional blocks, design simulation environment, run simulations and to tackle technical challenges to meet performance targets. You are going to work closely with physical layer algorithm developers, hardware designers and embedded SW experts. You will also coordinate works between different teams. The project is organized in very close cooperation with the Huawei wireless teams in Shanghai.
Qualifications and experience
We expect the candidate to have more than 5-10 years experiences on thermal design of high volume industrial products with high reliability requirements and challenging thermal conditions (car industry, marine applications, server industry, telecom, etc ) and that this have given the candidate a thorough and deep understanding of various cooling principles (direct air, HEX, etc) and a wide experience of CFD programs like : Ice Pack, Flotherm. We also expect that a substantial part of this cooling experience has been devoted to liquid cooling applications and the key components of this principle. We also expect an expertise of conceptual design of equipment and comparison of various thermal solutions in both the cost and the functionality perspective. For this position we prefer experiences of the ‘platform, concept & product portfolio’ discussions that take place during the initial phases of a product lifecycle. The candidate can of course communicate fluently in English, both verbally and in writing. We require Bachelor Degree, Masters in mechanical / or and electrical engineering or equivalent backgroundTheTo be successful in this role the candidate should have more than 4 years industrial or academia experience in areas of computer system, processor architecture, memory system, many core system, cache protocol and scheduling.
Preferred knowledge and experience:
Knowledge of wireless physical layer application;
Experience in program analysis and performance optimizations;
Experience in developing multi-threaded software;
Experience with functional and performance modeling;
Knowledge of mircro-architecture concepts.
A Ph.D or equivalent background in embedded system, computer science or computer engineering is required.
The candidates should have highly developed skills in finding new innovative solutions, strategic visions and ability of leading and driving activities. Prior experience from international and multicultural work is preferred. As we are a global company the candidate must be able to communicate fluently in English, both verbally and in writing.
This is a position at our R&D office in Kista, Stockholm, Sweden. Business travel is expected, both within Europe and to China.
For more information regarding the position, please contact;
Tommy Deng, phone: +46 739200807