About Huawei Sweden R&D
Founded in 1988, Huawei Technologies has grown into a global leader in telecommunications and network solutions, with innovation at the core of everything we do. Huawei established its first overseas R&D office in Sweden in 2000, and since then, we’ve expanded rapidly. Today, over 400 R&D engineers are pushing boundaries in Stockholm, Gothenburg, and Lund, working on groundbreaking 6G wireless systems that shape tomorrow’s technology.

Join us on our journey to develop the future of tech and be a part of a team that thrives on innovation, works hard to solve the industry’s biggest challenges, and collaborates with top engineers worldwide. If you’re ready to contribute to world-changing advancements, we want you on board!

Project Overview

Addressing thermal challenges is crucial for operation of modern electronics. Our thermal research team is developing various technologies that support thermal management of high-performance electronic equipment.

We invite to join us in developing high performance thermosyphon - a passive heat transfer device which operation relies on liquid-to-vapour phase change to efficiently manage thermal loads. Successful applicant will contribute by developing a numerical model of thermosyphon thermo-hydraulic behavior and validating it against experimental data. The detailed outline of the project will be developed together with the applicant.

Thesis project work will be in close contact with our international team, offering an excellent opportunity to apply academic experience in an industry relevant environment.

Your Profile

• Master student with strong background in thermodynamics and heat transfer;
• familiar with phase-change heat transfer and two-phase flow;
• possesses strong skills in numerical modeling or experimental techniques, or both;

Application Process

The project starts early 2025, and the applicants are reviewed on a rolling basis until the position is filled.

For more information regarding to this opportunity, please contact:

Bo Lundblad, Lab Director of MPE & Module Engineering Lab

E-mail: bo.lundblad@huawei.com

Phone: 0739200538